| dc.contributor.author | SOSIATI, HARINI | |
| dc.contributor.author | KUWANO, NORIYUKI | |
| dc.contributor.author | HATA, SATOSHI | |
| dc.contributor.author | IWANE, Y | |
| dc.contributor.author | MORIZONO, Y | |
| dc.contributor.author | OHNO, Y | |
| dc.date.accessioned | 2017-08-10T22:41:57Z | |
| dc.date.available | 2017-08-10T22:41:57Z | |
| dc.date.issued | 2006-12-06 | |
| dc.identifier.citation | 3 | en_US |
| dc.identifier.uri | http://repository.umy.ac.id/handle/123456789/12717 | |
| dc.description.abstract | Tin whiskers grown on a Sn/Cu-plated Polyimide (PI)-flexible substrate are a serious problem in electronic industrial application, because the whiskers lead to catastrophic electrical short circuit failures. Here, we report characterization of microstructures in the whiskers grown on a surface of Sn/Cu-plated PI-flexible substrate by crosssectional transmission electron microscopy (TEM) to analyze the behavior and the formation mechanism of whiskers. The whisker was found to be monocrystalline beta-Sn and grown with the preferred directions of [110] and [101]. The whiskers formed on this tin surface are nucleated and grown by the compressive stress, that is induced externally by insertion of Sn/Cu-plated PI-flexible
substrate into the connector. | en_US |
| dc.description.sponsorship | Nanotechnology Support Project of the Ministry of Education, Science, Culture, Sports
and Technology, Japan. | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | IEEE | en_US |
| dc.subject | Research Subject Categories::TECHNOLOGY | en_US |
| dc.subject | Research Subject Categories::INTERDISCIPLINARY RESEARCH AREAS | en_US |
| dc.subject | Tin whisker, Lead-free alloy, Microstructure, TEM | en_US |
| dc.title | TIN WHISKER FORMATION ON A LEAD-FREE SOLDER ALLOY STUDIED BY TRANSMISSION ELECTRON MICROSCOPY | en_US |
| dc.type | Article | en_US |
