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dc.contributor.authorSOSIATI, HARINI
dc.contributor.authorKUWANO, NORIYUKI
dc.contributor.authorHATA, SATOSHI
dc.contributor.authorIWANE, Y
dc.contributor.authorMORIZONO, Y
dc.contributor.authorOHNO, Y
dc.date.accessioned2017-08-10T22:41:57Z
dc.date.available2017-08-10T22:41:57Z
dc.date.issued2006-12-06
dc.identifier.citation3en_US
dc.identifier.urihttp://repository.umy.ac.id/handle/123456789/12717
dc.description.abstractTin whiskers grown on a Sn/Cu-plated Polyimide (PI)-flexible substrate are a serious problem in electronic industrial application, because the whiskers lead to catastrophic electrical short circuit failures. Here, we report characterization of microstructures in the whiskers grown on a surface of Sn/Cu-plated PI-flexible substrate by crosssectional transmission electron microscopy (TEM) to analyze the behavior and the formation mechanism of whiskers. The whisker was found to be monocrystalline beta-Sn and grown with the preferred directions of [110] and [101]. The whiskers formed on this tin surface are nucleated and grown by the compressive stress, that is induced externally by insertion of Sn/Cu-plated PI-flexible substrate into the connector.en_US
dc.description.sponsorshipNanotechnology Support Project of the Ministry of Education, Science, Culture, Sports and Technology, Japan.en_US
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.subjectResearch Subject Categories::TECHNOLOGYen_US
dc.subjectResearch Subject Categories::INTERDISCIPLINARY RESEARCH AREASen_US
dc.subjectTin whisker, Lead-free alloy, Microstructure, TEMen_US
dc.titleTIN WHISKER FORMATION ON A LEAD-FREE SOLDER ALLOY STUDIED BY TRANSMISSION ELECTRON MICROSCOPYen_US
dc.typeArticleen_US


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