Search
Now showing items 1-3 of 3
TIN WHISKER FORMATION ON A LEAD-FREE SOLDER ALLOY STUDIED BY TRANSMISSION ELECTRON MICROSCOPY
(IEEE, 2006-12-06)
Tin whiskers grown on a Sn/Cu-plated Polyimide (PI)-flexible substrate are a serious problem in electronic industrial application, because the whiskers lead to catastrophic electrical short circuit failures. Here, we report ...
MICROSTRUCTURES OF MGB2 /FE TAPES FABRICATED BY AN IN SITU POWDER-IN-TUBE METHOD USING MGH2 AS A PRECURSOR POWDER
(IOP, 2006-01-04)
Microstructures of MgB2/Fe tapes fabricated by an in situ powder-in-tube method using MgH2 as a precursor powder have been studied by means of x-ray diffraction and analytical transmission electron microscopy combined with ...
REMOVING FOCUSED ION-BEAM DAMAGES ON TRANSMISSION ELECTRON MICROSCOPY SPECIMENS BY USING A PLASMA CLEANER
(OXFORD Academic, 2006-03-01)
A plasma cleaner is usually used for removing carbonaceous debris from a specimen and preventing contamination during transmission electron microscopy (TEM) imaging and analysis. However, the plasma cleaner can be effectively ...