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TIN WHISKER FORMATION ON A LEAD-FREE SOLDER ALLOY STUDIED BY TRANSMISSION ELECTRON MICROSCOPY
(IEEE, 2006-12-06)
Tin whiskers grown on a Sn/Cu-plated Polyimide (PI)-flexible substrate are a serious problem in electronic industrial application, because the whiskers lead to catastrophic electrical short circuit failures. Here, we report ...
RELATIONSHIP BETWEEN MICROSTRUCTURE AND JC PROPERTY IN MGB2/Α-AL2O3 FILM FABRICATED BY IN SITU ELECTRON BEAM EVAPORATION
(IOP, 2005-08-09)
A transmission electron microscopy (TEM) study has been carried out on an MgB2/α-Al2O3 film that exhibits the typical property of critical current density (Jc) under magnetic fields. The MgB2 layer of 300 nm in thickness ...
TRANSMISSION ELECTRON MICROSCOPY ANALYSIS OF C4H4S-doped MgB2 TAPES
(IOP, 2008)
It has been reported that doping with aromatic hydrocarbons in an in situ powder-intube
fabrication process of MgB2 tapes is effective for increasing the critical current density (Jc) under magnetic fields. In this study, ...
FABRICATION OF MULTILAYERED MGB2/NI THIN FILMS AND THEIR FLUX PINNING PROPERTIES
(IEEE, 2009)
We prepared the multilayered MgB2/Ni thin films with the Ni layer spacings of 32, 23 and 16 nm. The
multilayer nanostructure was confirmed to be obtained from the scanning transmission electron microscope observation. The ...