Now showing items 1-2 of 2
EFFECTS OF POST-PLATING REFLOW ON CHANGES IN CRYSTAL GRAIN SIZE OF SN-2 MASS% BI ALLOY PLATING WITH THERMAL CYCLING TREATMENT
(The Japan Institute of Metals and Materials, 2010-10-01)
Changes in the grain size of tin (Sn) crystals associated with a thermal cycling treatment were investigated for layers of Sn-2 mass%Bi electroplated on Fe-42Ni substrates in order to clarify the eﬀects of post-plating ...
TEM AND SEM ANALYSIS FOR FORMATION MECHANISM OF TIN WHISKERS
(Trans Tech Publications, 2012-07-09)
Close observation with a transmission electron microscope (TEM) and a scanning electron microscope (SEM) was performed for the growth process of tin (Sn) whiskers on lead (Pb)-free Sn-plating. Whiskers were formed on a ...