Search
Now showing items 1-2 of 2
TIN WHISKER FORMATION ON A LEAD-FREE SOLDER ALLOY STUDIED BY TRANSMISSION ELECTRON MICROSCOPY
(IEEE, 2006-12-06)
Tin whiskers grown on a Sn/Cu-plated Polyimide (PI)-flexible substrate are a serious problem in electronic industrial application, because the whiskers lead to catastrophic electrical short circuit failures. Here, we report ...
EFFECT OF BALL-MILLING TREATMENT ON MICROSTRUCTURE OF IN SITU POWDER-IN-TUBE (PIT) MGB2 TAPE
(American Institute of Physics (AIP), 2012-06-25)
In an in situ powder-in-tube (PIT) fabrication of MgB2 superconducting tapes, it has been found that ball-milling treatment on a starting powder is effective for improving critical current density (Jc) of the MgB2 tapes. ...