View Item 
      •   UMY Repository
      • 04. LECTURERS ACADEMIC ACTIVITIES
      • CONFERENCE
      • View Item
      •   UMY Repository
      • 04. LECTURERS ACADEMIC ACTIVITIES
      • CONFERENCE
      • View Item
      JavaScript is disabled for your browser. Some features of this site may not work without it.

      TIN WHISKER FORMATION ON A LEAD-FREE SOLDER ALLOY STUDIED BY TRANSMISSION ELECTRON MICROSCOPY

      Thumbnail
      View/Open
      Conference article (2.198Mb)
      Date
      2006-12-06
      Author
      SOSIATI, HARINI
      KUWANO, NORIYUKI
      HATA, SATOSHI
      IWANE, Y
      MORIZONO, Y
      OHNO, Y
      Metadata
      Show full item record
      Abstract
      Tin whiskers grown on a Sn/Cu-plated Polyimide (PI)-flexible substrate are a serious problem in electronic industrial application, because the whiskers lead to catastrophic electrical short circuit failures. Here, we report characterization of microstructures in the whiskers grown on a surface of Sn/Cu-plated PI-flexible substrate by crosssectional transmission electron microscopy (TEM) to analyze the behavior and the formation mechanism of whiskers. The whisker was found to be monocrystalline beta-Sn and grown with the preferred directions of [110] and [101]. The whiskers formed on this tin surface are nucleated and grown by the compressive stress, that is induced externally by insertion of Sn/Cu-plated PI-flexible substrate into the connector.
      URI
      http://repository.umy.ac.id/handle/123456789/12717
      Collections
      • CONFERENCE

      DSpace software copyright © 2002-2015  DuraSpace
      Contact Us | Send Feedback
      Theme by 
      @mire NV
       

       

      Browse

      All of UMY RepositoryCollectionsBy Issue DateAuthorsTitlesSubjectsThis CollectionBy Issue DateAuthorsTitlesSubjects

      My Account

      Login

      DSpace software copyright © 2002-2015  DuraSpace
      Contact Us | Send Feedback
      Theme by 
      @mire NV