dc.contributor.author | KUWANO, NORIYUKI | |
dc.contributor.author | HORIKAMI, SADANORI | |
dc.contributor.author | MAEDA, MASANORI | |
dc.contributor.author | SOSIATI, HARINI | |
dc.date.accessioned | 2017-08-16T23:27:09Z | |
dc.date.available | 2017-08-16T23:27:09Z | |
dc.date.issued | 2012-07-09 | |
dc.identifier.citation | 1 | en_US |
dc.identifier.other | doi:10.4028/www.scientific.net/AMR.545.16 | |
dc.identifier.uri | http://repository.umy.ac.id/handle/123456789/13018 | |
dc.description.abstract | Close observation with a transmission electron microscope (TEM) and a scanning electron
microscope (SEM) was performed for the growth process of tin (Sn) whiskers on lead (Pb)-free
Sn-plating. Whiskers were formed on a Sn layer plated on Cu/polyimide flexible substrate. The
whisker was found to be of a single crystal and have a characteristic "Y"-shaped grain boundary
structure at its root. The growth process of a curling whisker was successfully observed in a
continuous way in SEM. TEM observation revealed that the curling whisker had a single
crystallographic orientation irrespective with its external shape. these microstructures indicate that
the rearrangement of dislocations plays an important role in the growth process of whiskers. | en_US |
dc.description.sponsorship | Close observation with a transmission electron microscope (TEM) and a scanning electron
microscope (SEM) was performed for the growth process of tin (Sn) whiskers on lead (Pb)-free
Sn-plating. Whiskers were formed on a Sn layer plated on Cu/polyimide flexible substrate. The
whisker was found to be of a single crystal and have a characteristic "Y"-shaped grain boundary
structure at its root. The growth process of a curling whisker was successfully observed in a
continuous way in SEM. TEM observation revealed that the curling whisker had a single
crystallographic orientation irrespective with its external shape. these microstructures indicate that
the rearrangement of dislocations plays an important role in the growth process of whiskers. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Trans Tech Publications | en_US |
dc.subject | Research Subject Categories::TECHNOLOGY | en_US |
dc.subject | Research Subject Categories::INTERDISCIPLINARY RESEARCH AREAS | en_US |
dc.title | TEM AND SEM ANALYSIS FOR FORMATION MECHANISM OF TIN WHISKERS | en_US |
dc.type | Article | en_US |