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TRANSMISSION ELECTRON MICROSCOPY OF SPONTANEOUS TIN (SN) WHISKER GROWTH UNDER HIGH TEMPERATURE/HUMIDITY STORAGE
(IEEE, 2008-12-09)
The present work is devoted to characterize the microstructures of Sn/Cu lead-frame attached on the printed circuit board (PCB) and of tin-whiskers formed on the Sn-surface after exposure under 85C/85 %RH for 1000 and ...
TIN WHISKER FORMATION ON A LEAD-FREE SOLDER ALLOY STUDIED BY TRANSMISSION ELECTRON MICROSCOPY
(IEEE, 2006-12-06)
Tin whiskers grown on a Sn/Cu-plated Polyimide (PI)-flexible substrate are a serious problem in electronic industrial application, because the whiskers lead to catastrophic electrical short circuit failures. Here, we report ...
RELATIONSHIP BETWEEN MICROSTRUCTURE AND JC PROPERTY IN MGB2/Α-AL2O3 FILM FABRICATED BY IN SITU ELECTRON BEAM EVAPORATION
(IOP, 2005-08-09)
A transmission electron microscopy (TEM) study has been carried out on an MgB2/α-Al2O3 film that exhibits the typical property of critical current density (Jc) under magnetic fields. The MgB2 layer of 300 nm in thickness ...
TRANSMISSION ELECTRON MICROSCOPY ANALYSIS OF C4H4S-doped MgB2 TAPES
(IOP, 2008)
It has been reported that doping with aromatic hydrocarbons in an in situ powder-intube
fabrication process of MgB2 tapes is effective for increasing the critical current density (Jc) under magnetic fields. In this study, ...
MBE FABRICATION OF MNX P NANOWHISKERS
(2008)
MnP and MnP nanowhiskers have been grown by molecular-beam epitaxy (MBE)
technique on InP(100) and GaAs(111)B substrates. The catalyst-free growth of nanowhiskers
is found to be depended on the formation of Mn-based ...
TEM AND SEM ANALYSIS FOR FORMATION MECHANISM OF TIN WHISKERS
(Trans Tech Publications, 2012-07-09)
Close observation with a transmission electron microscope (TEM) and a scanning electron
microscope (SEM) was performed for the growth process of tin (Sn) whiskers on lead (Pb)-free
Sn-plating. Whiskers were formed on a ...