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TRANSMISSION ELECTRON MICROSCOPY OF SPONTANEOUS TIN (SN) WHISKER GROWTH UNDER HIGH TEMPERATURE/HUMIDITY STORAGE
(IEEE, 2008-12-09)
The present work is devoted to characterize the microstructures of Sn/Cu lead-frame attached on the printed circuit board (PCB) and of tin-whiskers formed on the Sn-surface after exposure under 85C/85 %RH for 1000 and ...