Browsing CONFERENCE by Author "OHNO, Y"

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TIN WHISKER FORMATION ON A LEAD-FREE SOLDER ALLOY STUDIED BY TRANSMISSION ELECTRON MICROSCOPY

SOSIATI, HARINI; KUWANO, NORIYUKI; HATA, SATOSHI; IWANE, Y; MORIZONO, Y; OHNO, Y (IEEE, 2006-12-06)

Tin whiskers grown on a Sn/Cu-plated Polyimide (PI)-flexible substrate are a serious problem in electronic industrial application, because the whiskers lead to catastrophic electrical short circuit failures. Here, we report ...
TRANSMISSION ELECTRON MICROSCOPY OF SPONTANEOUS TIN (SN) WHISKER GROWTH UNDER HIGH TEMPERATURE/HUMIDITY STORAGE

SOSIATI, HARINI; HIROKADO, N; KUWANO, NORIYUKI; OHNO, Y (IEEE, 2008-12-09)

The present work is devoted to characterize the microstructures of Sn/Cu lead-frame attached on the printed circuit board (PCB) and of tin-whiskers formed on the Sn-surface after exposure under 85C/85 %RH for 1000 and ...