The present work is devoted to characterize the microstructures of Sn/Cu lead-frame attached on the printed circuit board (PCB) and of tin-whiskers formed on the Sn-surface after exposure under 85C/85 %RH for 1000 and ...

Tin whiskers grown on a Sn/Cu-plated Polyimide (PI)-flexible substrate are a serious problem in electronic industrial application, because the whiskers lead to catastrophic electrical short circuit failures. Here, we report ...

In an in situ powder-in-tube (PIT) fabrication of MgB2 superconducting tapes, it has been found that ball-milling treatment on a starting powder is effective for improving critical current density (Jc) of the MgB2 tapes. ...

Surface treatments on kenaf bast fibers were carried out with steam, alkali and a combination of steam-alkali. To verify and gain an understanding of their inter-relationship, tensile strength, surface morphology and ...