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TRANSMISSION ELECTRON MICROSCOPY OF SPONTANEOUS TIN (SN) WHISKER GROWTH UNDER HIGH TEMPERATURE/HUMIDITY STORAGE
The present work is devoted to characterize the microstructures of Sn/Cu lead-frame attached on the printed circuit board (PCB) and of tin-whiskers formed on the Sn-surface after exposure under 85C/85 %RH for 1000 and ...
TIN WHISKER FORMATION ON A LEAD-FREE SOLDER ALLOY STUDIED BY TRANSMISSION ELECTRON MICROSCOPY
Tin whiskers grown on a Sn/Cu-plated Polyimide (PI)-flexible substrate are a serious problem in electronic industrial application, because the whiskers lead to catastrophic electrical short circuit failures. Here, we report ...
EFFECT OF BALL-MILLING TREATMENT ON MICROSTRUCTURE OF IN SITU POWDER-IN-TUBE (PIT) MGB2 TAPE
(American Institute of Physics (AIP), 2012-06-25)
In an in situ powder-in-tube (PIT) fabrication of MgB2 superconducting tapes, it has been found that ball-milling treatment on a starting powder is effective for improving critical current density (Jc) of the MgB2 tapes. ...
RELATIONSHIPS BETWEEN TENSILE STRENGTH, MORPHOLOGY AND CRYSTALLINITY OF TREATED KENAF BAST FIBERS
(American Institute of Physics (AIP), 2013-09-09)
Surface treatments on kenaf bast fibers were carried out with steam, alkali and a combination of steam-alkali. To verify and gain an understanding of their inter-relationship, tensile strength, surface morphology and ...