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RELATIONSHIPS BETWEEN TENSILE STRENGTH, MORPHOLOGY AND CRYSTALLINITY OF TREATED KENAF BAST FIBERS
(American Institute of Physics (AIP), 2013-09-09)
Surface treatments on kenaf bast fibers were carried out with steam, alkali and a combination of steam-alkali. To verify and gain an understanding of their inter-relationship, tensile strength, surface morphology and ...
TRANSMISSION ELECTRON MICROSCOPY OF SPONTANEOUS TIN (SN) WHISKER GROWTH UNDER HIGH TEMPERATURE/HUMIDITY STORAGE
(IEEE, 2008-12-09)
The present work is devoted to characterize the microstructures of Sn/Cu lead-frame attached on the printed circuit board (PCB) and of tin-whiskers formed on the Sn-surface after exposure under 85C/85 %RH for 1000 and ...
TIN WHISKER FORMATION ON A LEAD-FREE SOLDER ALLOY STUDIED BY TRANSMISSION ELECTRON MICROSCOPY
(IEEE, 2006-12-06)
Tin whiskers grown on a Sn/Cu-plated Polyimide (PI)-flexible substrate are a serious problem in electronic industrial application, because the whiskers lead to catastrophic electrical short circuit failures. Here, we report ...
EFFECT OF BALL-MILLING TREATMENT ON MICROSTRUCTURE OF IN SITU POWDER-IN-TUBE (PIT) MGB2 TAPE
(American Institute of Physics (AIP), 2012-06-25)
In an in situ powder-in-tube (PIT) fabrication of MgB2 superconducting tapes, it has been found that ball-milling treatment on a starting powder is effective for improving critical current density (Jc) of the MgB2 tapes. ...